Products
Grinding Tape
Grinding tape protects wafer surface circuitry from damage or contamination during the wafer backside grinding process.
- Two types of grinding tape are available: UV and non-UV.
- MKT's exclusive intermediate layer provides excellent coverage of height bump wafers and is less likely to cause surface dimples and warpage.
- MKT's grinding tapes are easy to remove after the process is completed and with a low chance of damage and glue residue.
Product Structure
Product Spec
| UV440 | UV595 | UV170 | |
| Base Film : | PET | PET | PET |
| Base Film Thickness | 75 um | 75 um | 50um |
| Intermediate | 315 | 500 | 100 |
| Adhesive Base: | Acrylic | Acrylic | Acrylic |
| UV Adhesive | 50 | 20 | 20 |
| Total Thickness | 440 | 595 | 170 |
| 180°Peel AF after UV (unit : g/25 mm) on SUS | 30↓ | ||
| 180°Peel AF before UV (unit : g/25 mm) on SUS | 550±100 | 400↓ | 1300±200 |
| Lamination Condition | 65±10℃ @1mins | 65±10℃ @ 1mins | 25±5℃ |
| UV release amount | 360~500mj/cm2 | 250~500mj/cm2 | 360~500mj/cm2 |
Related Products
-
Dicing Tape
-
Laser Debond Material
-
Die Attach film/DAF
-
Polyimide Tape
-
Material Punch
-
Low temperature DAF
Customized Products
Customized Product Spec
Tape customization specifications
| Product | Adhesive thickness | Base Film | Extra Process | Adhesion Strength |
| PI Tape | 8um~120um | PI 12.5um~150um | Punch/split/ESD | 5g~2,000g |
| UV Tape | *8um~80um(~400um) | PO 80um/150um PET 25um~100um | 300g~2,000g | |
| Thermal release tape | 40um~60um | PET/PI 25um/50um/100um | Punch /split/ESD | 100g~600g |
Non-tape customization specifications
| Heterogeneous Integration | Thickness | Remark |
| DAF | 10um~120um | *under development |
| Laser Debond material | 10um~50um / 0.5um~1.5um | Film/Liquid |