Products
Dicing Tape
This type of tape is applied for the dicing process, and it can fix the chip to prevent the occurrence of chip-flying.
- Two types of dicing tape are available: UV and non-UV.
- MKT dicing tapes have stable adhesion and excellent ductility, no wafer displacement or flying chips, and are suitable for film expansion products.
- The tapes are easy to unstick, with excellent chip extraction efficiency.
Product Structure
Product Spec
| Product Information | ||
| Base Film (um) | PET 50~100 | PO 80~150 |
| Adhesive Thickness (um) | 8~20 | |
| Adhesive Strength before UV on SUS (gf/inch) | 300~2,000 | 300~15,00 |
| Adhesive Strength after UV on SUS (gf/inch) | 10 ↓ | |
| Heat Resistance Temp. | Max. 60 | |
Related Products
-
Grinding Tape
-
Laser Debond Material
-
Die Attach film/DAF
-
Polyimide Tape
-
Material Punch
-
Low temperature DAF
Customized Products
Customized Product Spec
Tape customization specifications
| Product | Adhesive thickness | Base Film | Extra Process | Adhesion Strength |
| PI Tape | 8um~120um | PI 12.5um~150um | Punch/split/ESD | 5g~2,000g |
| UV Tape | *8um~80um(~400um) | PO 80um/150um PET 25um~100um | 300g~2,000g | |
| Thermal release tape | 40um~60um | PET/PI 25um/50um/100um | Punch /split/ESD | 100g~600g |
Non-tape customization specifications
| Heterogeneous Integration | Thickness | Remark |
| DAF | 10um~120um | *under development |
| Laser Debond material | 10um~50um / 0.5um~1.5um | Film/Liquid |