Mingkun Technologies Co., Ltd
CN EN

Products

Material Punch

Material Punch

This product can be applied to laminating, slitting, punching, film pre-cutting, the design of processing surfaces, etc.

  1. Punch tape has been widely used for temporary bonding in the heating process.
  2. Punching material can be shipped in sheets or rolls.

Customized material punch process

Single/ Double Side Tape

Heat Sink

Stiffener

Related Products

  • Grinding Tape

  • Polyimide Tape

  • Dicing Tape

  • Laser Debond Material

  • Die Attach film/DAF

  • Low temperature DAF

Customized Products

Customized Product Spec

Tape customization specifications
Product Adhesive thickness Base Film Extra Process Adhesion Strength
PI Tape 8um~120um PI 12.5um~150um Punch/split/ESD 5g~2,000g
UV Tape *8um~80um(~400um) PO 80um/150um PET 25um~100um 300g~2,000g
Thermal release tape 40um~60um PET/PI 25um/50um/100um Punch /split/ESD 100g~600g
Non-tape customization specifications
Heterogeneous Integration Thickness Remark
DAF 10um~120um *under development
Laser Debond material 10um~50um / 0.5um~1.5um Film/Liquid