Wafer dicing tapes use advanced technology to provide customized products

Mingkun Technologies Co., Ltd
CN EN

About

Honest and trustworthy business model
Attention to every link to meet the needs of customers

Established in 2007, Mingkun Technology (MKT) has been dedicated to the research, development, and manufacturing of semiconductor tapes, and continues to refine and improve the technology. In 2018, we set up a laboratory in the Central Taiwan Science Park and began to invest 100% in independent research and development of specialized semiconductor tapes and semiconductor-related materials to become a leader in the semiconductor industry supply chain in Taiwan.

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關於我們

Produts

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  • Grinding Tape

    Grinding Tape

  • Dicing Tape

    Dicing Tape

  • Laser Debond Material

    Laser Debond Material

  • Die Attach film/DAF

    Die Attach film/DAF

  • Polyimide Tape

    Polyimide Tape

  • Material Punch

    Material Punch

Latest News

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Our client

ASE

ASE

ChipMOS

ChipMOS

Chipbond

Chipbond

HimaxAUO

HimaxAUO

AUO

AUO

GCE

GCE

USI

USI

SPIL

SPIL

E Ink

E Ink

PlayNitride

PlayNitride

ams

ams

Kingbright

Kingbright

TCL CSOT

TCL CSOT

GTBF

GTBF