Products
Low temperature DAF
Low temperature DAF is an ultra-thin adhesive used in the semiconductor packaging process to connect semiconductor chips to circuit boards or chips.
Extremely strong viscosity, the chip is not easily displaced after curing
Can be used with advanced cutting processes such as DBG and SDBG
Extremely strong viscosity, the chip is not easily displaced after curing
Can be used with advanced cutting processes such as DBG and SDBG
Product structure
Product structure
| Appearance/Surface | Transparent/Flat | |||
| Thickness (without liner) (um) | 30 | |||
| Adhesive strength (Kg/cm²) | 10 | |||
| CTEα (ppm/°C) | 110 | |||
| Tg (°C) | 95 | |||
| Type | Material | |||
| Base film | Polyester | |||
| Adhesive | Epoxy | |||
| Liner | Polyester | |||
| Remarks | Sample transfer @ 1 atm pressure later oven 85℃ *20~60 sec Curing condition：85℃X 60 ~120min Store at -18 degrees*90days, usable time* 30days Please take-off the release film slowly The adherends to test the adhesion strength are glass and copper foil. The above information is for reference. |
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Related Products
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Grinding Tape
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Dicing Tape
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Laser Debond Material
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Die Attach film/DAF
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Polyimide Tape
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Material Punch
Customized Products
Customized product specifications
Customized specifications for tapes
| Product | Adhesive thickness | Base Film | Extra Process | Adhesion Strength |
| PI Tape | 8um~120um | PI 12.5um~150um | Punch/split/ESD | 5g~2,000g |
| UV Tape | *8um~80um(~400um) | PO 80um/150um PET 25um~100um | 300g~2,000g | |
| Thermal release tape | 40um~60um | PET/PI 25um/50um/100um | Punch /split/ESD | 100g~600g |
Customized specifications for non-tape products
| Heterogeneous Integration | Thickness | Remark |
| DAF | 10um~120um | *under development |
| Laser Debond material | 10um~50um / 0.5um~1.5um | Film/Liquid |