Products
Die Attach film/DAF
DAF(Die Attach Film) is an ultra-thin adhesive used to connect semiconductor chips to circuit boards or chip-to-chip in the semiconductor packaging process.
- Our DAF has very strong adhesion and keeps the chip from shifting after curing.
- This product can be designed with advanced cutting processes such as DBG and SDBG.
Product Structure
Product Spec
| Testing Properties of DAF | Testing Data | |||
| Curing Condition of DAF | ||||
| Wafer Mounting Temperature | 60~90℃ | |||
| DAF tape Curing Condition | Thermal cure Temperature | 150℃ | ||
| For bonding Chips or substrate | ||||
Related Products
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Low temperature DAF
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Grinding Tape
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Dicing Tape
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Laser Debond Material
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Polyimide Tape
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Material Punch
Customized Products
Customized Product Spec
Tape customization specifications
| Product | Adhesive thickness | Base Film | Extra Process | Adhesion Strength |
| PI Tape | 8um~120um | PI 12.5um~150um | Punch/split/ESD | 5g~2,000g |
| UV Tape | *8um~80um(~400um) | PO 80um/150um PET 25um~100um | 300g~2,000g | |
| Thermal release tape | 40um~60um | PET/PI 25um/50um/100um | Punch /split/ESD | 100g~600g |
Non-tape customization specifications
| Heterogeneous Integration | Thickness | Remark |
| DAF | 10um~120um | *under development |
| Laser Debond material | 10um~50um / 0.5um~1.5um | Film/Liquid |