Products
Laser Debond Material
- Before debonding, the temporary bonding adhesive has high adhesion to the wafer and can be quickly peeled off by laser.
- Excellent debond capability for laser 355nm/532nm/1064nm
- MKT laser debond materials can be preserved at room temperature.
Product Structure
Product Spec
| Properties | Unit | Value | |
| Liquid | Thickness | ㎛ | 0.5-1.5 |
| Viscosity | cPs | 50~1,000 | |
| Solid Content | % | 10~50% | |
| Dry Film | Thickness | um | 10~50 |
| Color | Color | - | Black |
| Curing condition | Thermal cure | ℃ x time | 150℃ x 120 mins |
| Heat Resistance Temp. | Max. | ℃ x time | 270℃ x 120 mins |
Related Products
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Low temperature DAF
-
Grinding Tape
-
Dicing Tape
-
Die Attach film/DAF
-
Polyimide Tape
-
Material Punch
Customized Products
Customized Product Spec
Tape customization specifications
| Product | Adhesive thickness | Base Film | Extra Process | Adhesion Strength |
| PI Tape | 8um~120um | PI 12.5um~150um | Punch/split/ESD | 5g~2,000g |
| UV Tape | *8um~80um(~400um) | PO 80um/150um PET 25um~100um | 300g~2,000g | |
| Thermal release tape | 40um~60um | PET/PI 25um/50um/100um | Punch /split/ESD | 100g~600g |
Non-tape customization specifications
| Heterogeneous Integration | Thickness | Remark |
| DAF | 10um~120um | *under development |
| Laser Debond material | 10um~50um / 0.5um~1.5um | Film/Liquid |